A team led by researchers at Rensselaer Polytechnic Institute (RPI) has made a breakthrough in semiconductor development that ...

Leading HBM device makers and foundries must simultaneously handle multi-layer chip stacking, die warpage, and shorter ...

The cohesin subunit Scc1 returns and reconstitutes the complex with Smc1–Smc3 in late mitosis upon DNA double-strand breaks, although it does not participate in homologous recombination-driven MAT ...

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