Tech Xplore

Direct approach can bond and debond 2D semiconductors without any glue-like materials

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
C&EN

Phosphonium-Organophosphate Ionic Liquids as Lubricant Additives: Effects of Cation Structure on Physicochemical and Tribological Characteristics

† Materials Science and Technology Division, Oak Ridge National Laboratory, P.O. Box 2008, MS-6063, Oak Ridge, Tennessee 37831-6063, United States ‡ Energy and Transportation Science Division, Oak ...
C&EN

Controlling the Intermediate Structure of an Ionic Liquid for f-Block Element Separations

† Oak Ridge National Laboratory, One Bethel Valley Road, P.O. Box 2008, Oak Ridge, Tennessee 37831, United States ‡ Biology and Soft Matter Division, Neutron Sciences Directorate, Oak Ridge National ...
IEEE

Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure

Abstract: Ball grid arrays (BGAs) and bonding wires (BW) are widely used in electronic packages, which may result in the impedance discontinuity. In this work, an optimization strategy, using the ...