The ISA Wars Have Ended And The Heterogeneous CPU Era Has Arrived

CPU architectures in a single system, whether that is a single system-on-chip (SoC) or a larger electronics platform ...
Compound Semiconductor

2D MoS₂ FPGA integrates 4000 FETs

Now a Chinese team, led by Peng Zhou and Wenzhong Bao at Fudan University, has developed a top-gate (TG) 2D ...
Marketing Dive

Inside Amazon DSP’s growing bid to marketers — and threat to competitors

Execs from Amazon and across the industry weigh in on a key part of the company’s surging ad business as its UnBoxed conference kicks off.
EDN

Mastering multi-physics effects in 3D IC design

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...