Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...

Abstract: The ball field design in a flip chip (FC) ball grid array (BGA) often becomes the determining factor for the package body size. This paper describes the physical definition of ball fields ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

IRONWOOD ELECTRONICS SG-BGA-6475 high performance BGA socket for 1mm pitch, 240 pin BGA IC’s is designed for IC size – 17x18mm package size and operates at bandwidths up to 27GHz with less than 1dB of ...

Linear Technology introduces over 53 µModule power products with SnPb BGA packages, targeting applications where the use of tin-lead soldering is preferred, such as in defense, avionics and heavy ...

IRONWOOD ELECTRONICS GT-BGA-2135 BGA socket design uses high performance elastomer capable of 94GHz, suitable for very low inductance and wide temperature applications. Device is designed for 21x21mm ...