Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- ...
Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.
SAN DIEGO, CA--(Marketwired - Jul 18, 2016) - 5D Robotics, Inc., announced today the acquisition of Time Domain, the world leader in Ultra-Wideband (UWB) technology products and services. The terms of ...
In 2014, 5D memory crystal technology set a Guinness World Record for being the most durable data storage material – a title that it still holds. Scientists are now exploring how 5D memory crystals, ...
Newly released iTero Workflow 2.0 software features include faster scanning, improved visualization, and enhanced patient communication tools that help increase practice efficiency, support better ...
SHANGHAI — VeriSilicon (688521.SH) today announced that Actions Technology (688049.SH), a low-power AIoT fabless semiconductor company, has adopted VeriSilicon’s power-efficient and feature-rich 2.5D ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, ...
Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- ...
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