YMTC is developing an advanced chip packaging technology known as through-silicon via YMTC's new Wuhan facility may produce DRAM chips BEIJING/SINGAPORE Sept 25 (Reuters) - China's top flash memory ...
To address the trade-off between capacity and bandwidth that has been a challenge with DRAM-based conventional memory modules, Kioxia has developed a new module configuration utilizing daisy-chained ...
The Chosun Ilbo on MSN
NAND Flash Market Surges as AI Demand Drives Storage Shift
As the spread of artificial intelligence (AI) drives up demand for HBM (high-bandwidth memory) and general-purpose DRAM, ...
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