Enabling higher power within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device, stackable ...
Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that ...
AI servers are running out of power and space. A small module can solve both, helping systems run better in tight designs. Find out more!
The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and ...
A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...
Beyond data centers and high-density computing racks, the air-cooled thermal module is particularly suitable for AI and HPC servers, edge computing modules, distributed computing systems, electric ...
The module is packaged in an innovative vertical construction that maximises board space efficiency and can provide up to a 40% board area reduction when compared to other solutions. The compact power ...
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