System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
Arthur Cao outlines how fresh approaches are needed to ensure tracker-based PV systems are designed adequately to avoid ...
CheckSum’s Analyst ems+ft system combines in-circuit test (ICT) and functional test to target OEMs and contract manufacturers building power supplies, automotive electronics, medical electronics, ...
The approach to high-end aerospace/defense test system development is shifting from application-specific systems to common core automated systems to reduce overall cost and increase flexibility.
Representing the most recent generation of double-data-rate (DDR) SDRAM memory, DDR4 and low-power LPDDR4 together provide improvements in speed, density, and power over DDR3. However, such speed and ...
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