SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced sampling 1 of the industry’s first 2 Universal Flash Storage 3 (UFS) Ver. 4.0 embedded flash memory devices 3 designed for ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling (1) new Universal Flash Storage (2) (UFS) Ver. 4.1 embedded memory devices ...

Intelligent Memory has introduced a new generation of embedded MultiMediaCards (eMMC) aimed at industrial applications.

Non-volatile technologies like MRAM and particularly ReRAM are poised to finally take a major leap into the embedded-memory design space. What is trending in embedded memory technology? Why ReRAM is ...

TOSHIBA OFFERS A WIDE RANGE OF EMBEDDED AND REMOVABLE MEMORY TO ADDRESS GROWING USE OF NAND FLASH IN MOBILE HANDSETS Multi-chip Packages, Package-on-Package Technology, MCPs with Configurable MLC and ...

TL;DR: KIOXIA's new UFS Ver. 4.1 embedded memory devices, featuring 8th generation BiCS FLASH with CBA technology, deliver up to 45% faster performance and 20% better power efficiency for mobile ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Micron stock has gained 327% over the last 12 months thanks to soaring demand for memory from data center operators.

Embedded systems demand high performance with minimal power consumption, and the optimisation of scratchpad memory (SPM) plays a critical role in meeting these stringent requirements. SPM, a small ...

SAN FRANCISCO – Dec. 10, 2024 – CEA-Leti research engineers in France have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the ...