Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...
Abstract: The ball field design in a flip chip (FC) ball grid array (BGA) often becomes the determining factor for the package body size. This paper describes the physical definition of ball fields ...
IRONWOOD ELECTRONICS SG-BGA-6475 high performance BGA socket for 1mm pitch, 240 pin BGA IC’s is designed for IC size – 17x18mm package size and operates at bandwidths up to 27GHz with less than 1dB of ...
Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...
Linear Technology introduces over 53 µModule power products with SnPb BGA packages, targeting applications where the use of tin-lead soldering is preferred, such as in defense, avionics and heavy ...
IRONWOOD ELECTRONICS GT-BGA-2135 BGA socket design uses high performance elastomer capable of 94GHz, suitable for very low inductance and wide temperature applications. Device is designed for 21x21mm ...
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