Between tariffs, inflation, a tough economy, and the ever-present reality of how challenging it is to make money from ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...

LOS ANGELES, May 19, 2020 /PRNewswire-PRWeb/ -- MedTech Breakthrough, an independent market intelligence organization that recognizes the top technology product companies in the global health and ...

LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Good day, ladies and gentlemen, and welcome to the Amkor Technology Second Quarter 2024 Earnings Conference Call. My name is Diego and I will be your conference facilitator today. Please note, we are ...